News

Starting from 2024 and after five successful events, the workshop has become the ACM/IEEE International Symposium on Machine Learning for CAD (MLCAD).

About

The symposium focuses on Machine Learning (ML) for all aspects of CAD and electronic system design. The symposium is sponsored by both the ACM Special Interest Group on Design Automation (SIGDA) and the IEEE Council on Electronic Design Automation (CEDA). The symposium program will have keynote and invited speakers in addition to technical presentations.
MLCAD 2024 will be held physically in Snowbird, Utah.

Focus

Advances in machine learning (ML) over the past half-dozen years have revolutionized the effectiveness of ML for a variety of applications. However, design processes present challenges that require synergetic advances in ML and CAD as compared to traditional ML applications. As such, the purpose of the symposium is to discuss, define and provide a roadmap for the special needs for ML for CAD where CAD is broadly defined to include both design-time techniques as well as run-time techniques.
Topics of interest to this symposium include but are not limited to:
• ML approaches to logic design.
• ML for physical design.
• ML for analog design.
• ML methods to predict and optimize circuit aging and reliability.
• Labeled and unlabeled data in ML for CAD.
• ML for power and thermal management.
• ML techniques for resource management in many-cores.
• ML for Design Technology Co-Optimization (DTCO).

2023 Sponsors

Sponsors for 2024 will be announced soon.

Diamond

Platinum

Gold

Silver

Committees

General Chairs

Hussam Amrouch, Technical University of Munich
Jiang Hu, Texas A&M University

Program Chairs

Siddharth Garg, New York University
Yibo Lin, Peking University

Sponsorship and Industrial Chair

Rajeev Jain, Qualcomm

Special Session / Invited Paper Chair

Youngsoo Shin, Korea Advanced Institute of Science & Technology (KAIST)

Finance Chair

Cunxi Yu, University of Maryland

Publicity Chair

Vidya A. Chhabria, Arizona State University

Publication Chair

Hammond Pearce, University of New South Wales

Steering Committee

Marilyn Wolf, University of Nebraska-Lincoln
Paul Franzon, North Carolina State University
Jörg Henkel, Karlsruhe Institute of Technology
Ulf Schlichtmann, Technical University of Munich

Cover image by Jay Dash, 2016